Heterogenous Integrated (HI) encompassing monolithic integration, and 2.5D/3D packaging is catching significant attention for meeting the system requirements. Inter-and intra-chip interconnects play an important role in HI as they govern the overall speed, reliability, power, cost, and scalability. While conventional wired interconnects have been mainstream approach for inter-and intra-chip signal transmission, photonics, and wireless interconnects have emerged to be promising options. Particularly, wireless interconnects can provide unique opportunities for trusted and untrusted chiplets integration post-fabrication of System in Package (SiP) and secure information sharing via various encryption schemes. On the other hand, diverse interconnect options provide different attack surfaces for side-channel attacks that needs to be investigated. This project will address these challenges and develop a systematic approach for secure SiP by utilizing the benefits of various interconnect technologies.